Research
DSP Processor Core Multimedia SoC RF/Mixed-Signal IC Low Power Design Technology Advanced IC Design & Test Service Core Capabilities

Research

STC keeps moving forward to meet domestic and international product development needs. It makes great efforts to eight R&D areas for providing most cutting-edge SoC ICs, platforms, design methodologies, and applications. With the mission of delivering chip-level solutions for mobile broadband, multimedia applications, and convergence services, STC especially focuses on two major R&D projects. One is Multi-Input-Multi-Output (MIMO) Mobile WiMAX SoC and the other is PAC (Parallel Architecture Core) DSP/Application Processor SoC.

Key R&D Subjects

• MIMO Mobile WiMAX, WiMAX/WiFi handover
• RF, AMS, Baseband PHY, MAC design
• Wireless Communication System Implementation and Testing
• DSP and Application Processor design
• Embedded Software System( OS, Middleware, Compiler… )
• Application Software and Hardware Implementation( A/V codec, Streaming, Security, Identification, Web… )
• Low Power design
• EDA( Electronic System-Level, 90nm/65nm Physical design, Testing/Testable design )
• PxD